Senior Optical Packaging Engineer

At Microsoft Research, we are shaping the future of AI infrastructure by pursuing high-risk and high-reward programs that will define the next generation of AI platforms. Our work spans the full stack, models, systems, software, and hardware, and we partner with product teams across Microsoft to turn research breakthroughs into impact at scale.

CPO Architecture & Packaging Co-Design: Design and development of packaging architectures for co-packaged optics, including integration of photonic devices, ASICs, and interposers.

Master’s or PhD’s degree in Electrical Engineering, Photonics, Materials Science, or a related field. Proven industry experience in wafer/panel level and advanced packaging with a strong focus on optical packaging.